Wylie BGA Reballing Stencil For iPhone - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
Code: APP19775
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Přes 3000 výdejních míst
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Product detailed description
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro MaxAdditional parameters
| Category: | Náhradní díly |
|---|---|
| Brand: | Apple |
| Product type: | BGA Chip Ball Template Stencil |
| Quality: | Aftermarket |
| Additional info: | For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max |
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