Wylie BGA Reballing Stencil For iPhone - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
Code: APP19775
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From 3G to the latest models.
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Orders from €40.
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Product detailed description
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro MaxAdditional parameters
| Category: | iPhone |
|---|---|
| EAN: | 8596698429558 |
| Brand: | Apple |
| Product type: | BGA Chip Ball Template Stencil |
| Quality: | Aftermarket |
| Additional info: | For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max |
| The item has been sold out… | |
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Orbitel is the in-house brand of the Orbitel.cz store, focused on spare parts and accessories for mobile phones and tablets.